My first surface-mount package

Up until now I’ve worked exclusively with through-hole components. While they’re great for fast prototyping, it’s becoming more difficult to find DIP versions of every part I need, especially for some of the more recently released devices (USB controllers, ARM-based MCUs). You may find a DIP package here and there, but the majority is only available in various surface-mount sizes. The only way for me to keep up is to learn how to solder surface-mount packages.

Over the past few months I’ve been gathering all the tools I need to move my soldering techniques to the next level. Last week I received the final parts on my list – a high-quality soldering station, iron tips for soldering surface-mount packages and a head-mounted magnifier. With everything ready for my first surface-mount experience, I grabbed one of my I2C EEPROMs and an adapter board, and gave it a try.

so8-soldered-closeup

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